optical ai

 

GenXComm’s Photonic Accelerator Circuits (PACs) for Deep Neural Networks are capable of up to 1000x improvement in Artificial Intelligence performance.

 
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Solid state, 3-D AI chip designs


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Greater densities, faster signal transmission, lower power, and reduced heat generation 


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10x-100x improvement in general purpose inference


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1000X improvement in training


Photonic Accelerator Circuits (PACs) can achieve orders of magnitude performance improvements for AI computation allowing AI processing to move from the cloud to your in-home wireless assistant or directly on your mobile device.  This provides faster, more secure AI processing, keeping your data on your device and eliminating the need to round trip requests from remote datacenters.

Our Photonic Accelerator Circuits (PACs) use low power laser source and 3-D solid state chip designs to overcome the limitations of conventional semi-conductor based CPUs.  Silicon photonics will help chip and systems performance to continue to scale post-Moore's law. Signals travel through these chips at the speed of light to achieve enormous improvements in processing speeds without the heat generation of today’s chipsets.  As today’s CPUs and GPUs reach their physical limits, PACs will become the foundation of next generation AI-enabled devices ushering in a second information revolution.

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